T1235-800R 查看數據表（PDF） - STMicroelectronics

零件编号

产品描述 (功能)

比赛名单

T1235-800R

12 A Snubberless™, logic level and standard triacs

STMicroelectronics 

Packaging information

3

Packaging information

BTA12, BTB12, T12xx

● Epoxy meets UL94, V0

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

Table 8. D2PAK dimensions

Dimensions

Ref.

Millimeters

Inches

Min. Typ. Max. Min. Typ. Max.

E

L2

A

C2

A 4.30

A1 2.49

A2 0.03

4.60 0.169

2.69 0.098

0.23 0.001

0.181

0.106

0.009

B 0.70

0.93 0.027

0.037

L

D

B2 1.25 1.40

0.048 0.055

L3

C 0.45

0.60 0.017

0.024

A1

C2 1.21

1.36 0.047

0.054

B2

B

C

R

D 8.95

9.35 0.352

0.368

G

E 10.00

10.28 0.393

0.405

A2

2mm min.

FLAT ZONE

G 4.88

L 15.00

5.28 0.192

15.85 0.590

0.208

0.624

V2

L2 1.27

1.40 0.050

0.055

L3 1.40

1.75 0.055

0.069

R

0.40

0.016

V2 0°

8° 0°

8°

Figure 15. Footprint (dimensions in mm)

16.90

10.30

8.90

5.08

1.30

3.70

8/12

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