CD4049UBMS(1997) 查看數據表（PDF） - Intersil
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CD4049UBMS Datasheet PDF : 7 Pages
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CD4049UBMS
Typical Performance Characteristics (Continued)
105 AMBIENT TEMPERATURE (TA)
86 = +25oC
4
2
104
86
4
SUPPLY VOLTAGE
(VDD) = 15V
103 2
86
4
2
102
8
6
4
10V
10V
5V
LOAD CAPACITANCE (CL) = 50pF
(11pF FIXTURE + 39pF EXT)
2
CL = 15pF (11pF FIXTURE + 4pF EXT
10
2 4 6 8 2 4 68 2 4 68 2 4 68
10
102
103
104
105
INPUT FREQUENCY (f) (kHz)
FIGURE 8. TYPICAL POWER DISSIPATION vs FREQUENCY
CHARACTERISTICS
106 AMBIENT TEMPERATURE (TA) = +25oC
105
15V; 1MHz
104
15V; 100KHz
103
10V; 100KHz
15V; 10KHz
102
10V; 10KHz
10
15V; 1KHz
SUPPLY VOLTAGE (VCC) = 5V
FREQUENCY (f) = 10KHz
1
10 102 103 104 105 106 107 108
INPUT RISE AND FALL TIME (tr, tf) (ns)
FIGURE 9. TYPICAL POWER DISSIPATION vs INPUT RISE
AND FALL TIMES PER INVERTER
Chip Dimensions and Pad Layout
Dimensions in parenthesis are in millimeters and are derived
from the basic inch dimensions as indicated. Grid
graduations are in mils (10-3 inch).
METALLIZATION: Thickness: 11kÅ − 14kÅ, AL.
PASSIVATION: 10.4kÅ - 15.6kÅ, Silane
BOND PADS: 0.004 inches X 0.004 inches MIN
DIE THICKNESS: 0.0198 inches - 0.0218 inches
7
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