CLA4601-000 查看數據表（PDF） - Skyworks Solutions

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CLA4601-000

CLA Series: Silicon Limiter Diodes, Packaged and Bondable Chips

Skyworks Solutions 

DATA SHEET • CLA SERIES DIODES

0.020 in.

Typ.

0.001 in. Gold Wire

Bond, Typical

50 Ω

Connector

Ground Solder or

Plane Epoxy Die Bond

Microstrip Board

TFG 0.006 in. Thick, Typical

Figure 6. Diodes in 50 Ω Microstrip Circuit (Side View)

Diode, Typical

TFG Board

Ground

Return

X1

X2

50 Ω

Conductor

0.022 in., Typical

Figure 7. Diodes in 50 Ω Microstrip Circuit (Top View)

Coil for Ground Return

50 Ω

X1

CJ

RR

CJ

X2

RP

CJ

50 Ω

RP

Figure 8. Low-Level Equivalent Circuit

Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com

6

September 28, 2009 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 200100I

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