CY2308 查看數據表（PDF） - Cypress Semiconductor
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CY2308 Datasheet PDF : 14 Pages
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CY2308
Package Drawings and Dimensions
Figure 7. 16-Pin (150 Mil) SOIC S16.15
16 Lead (150 Mil) SOIC
PIN 1 ID
8
1
DIMENSIONS IN INCHES[MM] MIN.
MAX.
REFERENCE JEDEC MS-012
0.150[3.810]
0.157[3.987]
0.230[5.842]
0.244[6.197]
PACKAGE WEIGHT 0.15gms
PART #
S16.15 STANDARD PKG.
9
16
SZ16.15 LEAD FREE PKG.
0.050[1.270]
BSC
0.386[9.804]
0.393[9.982]
0.0138[0.350]
0.0192[0.487]
SEATING PLANE
0.061[1.549]
0.068[1.727]
0.004[0.102]
0.004[0.102]
0.0098[0.249]
0° ~8°
0.016[0.406]
0.035[0.889]
Figure 8. 16-Pin TSSOP 4.40 MM Body Z16.173
0.010[0.254] X 45°
0.016[0.406]
0.0075[0.190]
0.0098[0.249]
51-85068-*B
0.65[0.025]
BSC.
0.85[0.033]
0.95[0.037]
PIN 1 ID
1
6.25[0.246]
6.50[0.256]
4.30[0.169]
4.50[0.177]
16
DIMENSIONS IN MM[INCHES] MIN.
MAX.
REFERENCE JEDEC MO-153
PACKAGE WEIGHT 0.05 gms
PART #
Z16.173 STANDARD PKG.
ZZ16.173 LEAD FREE PKG.
0.19[0.007]
0.30[0.012]
1.10[0.043] MAX.
4.90[0.193]
5.10[0.200]
0.05[0.002]
0.15[0.006]
0.076[0.003]
SEATING
PLANE
0.25[0.010]
BSC
GAUGE
PLANE
0° -8°
0.50[0.020]
0.70[0.027]
0.09[[0.003]
0.20[0.008]
51-85091-*A
Document Number: 38-07146 Rev. *F
Page 13 of 14
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