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DF14 查看數據表(PDF) - HIROSE ELECTRIC

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DF14 Datasheet PDF : 6 Pages
1 2 3 4 5 6
BPrecautions
1. Recommended Temperature Profile (SMT)
2. Recommended Manual Soldering Condition (SMT)
3. Recommended Screen Thickness (SMT)
4. Board Sled (SMT)
5. Cleaning Condition
6. Connection Condition
7. Cautions
Note 1.The soldering process is allowed up to twice under the same condition. However, the
interval between the first and second processes must be maintained at the room
temperature.
Note 1.The temperature indicates the board surface temperature on the connector lead area.
Manual soldering: 290ç for 2 seconds
0.15 to 0.2mm
Max 0.03mm at the connector center area, based on both connector edges
Refer to Nylon Connector Use Hand book.
Refer to Nylon Connector Use Hand book.
sBe careful to carry out the crimping operation according to the "Crimping Condition Sheet"
and "Crimping Quality Reference", because the crimping contact style is too small.
sBe careful for an excessive scoop insertion/extraction, which will cause damage to the
product.
B182

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