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DF19-14P-1H 查看數據表(PDF) - HIROSE ELECTRIC

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DF19-14P-1H Datasheet PDF : 13 Pages
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The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
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BUse recommendations
1. Recommendedtemperature profile
Temperature(ç)
250ç
200ç
150ç
100ç
50ç
220
180
Preheating
60 to 120(S)
soldering
250ç 10(s)max
220ç min 60(s)max
2. Manual soldering
3. Screen thickness
4. Board warpage
5. Cleaning conditions
6. Termination conditions
7. Precautions
8. Precautions
30 50
100
150
200 TIME(S)
Note 1: Up to 2 cycles of Reflow soldering are possible under the same
conditions, provided that there is a return to normal temperature
between the first and second cycle.
Note 2: The temperature profile indicates the board surface temperature at
the point of contacts with the connector terminals.
Note 3: The product can be used without trouble though the surface of a
grounding plate might discolor.
Manual soldering: 290±10ç for 3 seconds
0.15mm
Maximum of 0.03mm at the connector center, with both ends of the connector as
reference points.
Refer to “Nylon Connector Use Handbook.”
Refer to “Nylon Connector Use Handbook.”
Do not twist when mating/un-mating.
Refer to “Nylon Connector Use Handbook.”
B264

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