E211ATF 查看數據表（PDF） - Semtech Corporation
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E211ATF Datasheet PDF : 12 Pages
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Edge211
TEST AND MEASUREMENT PRODUCTS
Package Information (continued)
DETAIL "A"
3
e/2
b
– 0.05 S
A2
DATUM
PLANE
–H–
A1
SECTION C–C
DETAIL "B"
0 MIN.
0.08 / 0.20 R.
0.25
GAUGE PLANE
C.08
R. MIN.
0.20 MIN.
1.00 REF.
0–7
L
0.05
8 PLACES
11 / 13
M
A
–H– 2
ccc
–C–
/ / 0.10 C
SEE DETAIL "B"
Notes:
1. All dimensions and tolerances conform to ANSI
Y14.5-1982.
2. Datum plane -H- located at mold parting line and
coincident with lead, where lead exits plastic
body at bottom of parting line.
3. Datums A-B and -D- to be determined at
centerline between leads where leads exit
plastic body at datum plane -H-.
4. To be determined at seating plane -C-.
5. Dimensions D1 and E1 do not include mold
protrusion.
6. “N” is the total # of terminals.
7. These dimensions to be determined at the
datum plane -H-.
8. Package top dimensions are smaller than
bottom dimensions and top of package will
not overhang bottom of package.
9. Dimension b does not include dambar
protrusion. Allowable dambar protrusion
shall be 0.08 mm total in excess of the b
dimension at maximum material condition.
Dambar cannot be located on the lower
radius or the foot.
10. Controlling dimension: millimeter.
11. Maximum allowable die thickness to be
assembled in this package family is 0.30
millimeters.
12. This outline conforms to JEDEC publication 95,
registration MO-136, variations AC, AE, and AF.
2005 Semtech Corp., Rev. 6, 2/28/05
8
;;;;;; 0.09 / 0.20
9
b
ddd M C A – B S D S
WITH LEAD FINISH
Lead
0.09 / 0.16 Cross Section
b1
BASE METAL
JEDEC VARIATION
All Dimensions in Millimeters
AC
Min. Nom. Max. Note
A
1.60
A1 0.05 0.10 0.15
A2 1.35 1.40 1.45
D
9.00 BSC.
4
D1
7.00 BSC.
7,8
E
9.00 BSC.
4
E1
7.00 BSC.
7,8
L 0.45 0.60 0.75
M 0.15
N
32
e
0.80 BSC.
b 0.30 0.37 0.45
9
b1 0.30 0.35 0.40
ccc
0.10
ddd
0.20
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