RF2161 查看數據表（PDF） - RF Micro Devices
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RF2161 Datasheet PDF : 8 Pages
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RF2161
Preliminary
Pin
Pkg
Base
Function
GND
Description
Ground connection. The backside of the package should be soldered
to a top side ground pad which is connected to the ground plane with
multiple vias. The pad should have a short thermal path to the ground
plane.
Interface Schematic
2
2-200
Rev A3 010514
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