FAN5099MTCX(2006) 查看數據表（PDF） - Fairchild Semiconductor

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FAN5099MTCX
(Rev.:2006)

Wide Frequency Synchronous Buck PWM & LDO Controller

Fairchild Semiconductor 

Absolute Maximum Ratings

The “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. The

device should not be operated at these limits. The parametric values defined in the Electrical Characteristics tables

are not guaranteed at the absolute maximum ratings. The “Recommended Operating Conditions” table defines the

conditions for actual device operation.(1)

Parameter

VCC to PGND

BOOT to PGND

SW to PGND

Continuous

Transient (t < 50ns, f < 500kHz)

HDRV (VBOOT – VSW)

LDRV

All Other Pins

Maximum Shunt Current for VCC

Electrostatic Discharge (ESD) Protection

Level(2)

HBM

CDM

Min.

-0.5

-3.0

-0.5

-0.3

3.5

1.8

Max.

6.0

33.0

33.0

33.0

6.0

6.0

VCC + 0.3

150

Unit

V

V

V

V

V

V

V

mA

kV

Notes:

1. Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This

is a stress rating only; functional operation of the device at these or any conditions above those indicated in the

operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended

periods may affect device reliability. Absolute maximum ratings apply individually only, not in combination. Unless

otherwise specified, all other voltages are referenced to AGND.

2. Using Mil Std. 883E, method 3015.7 (Human Body Model) and EIA/JESD22C101-A (Charge Device Model).

Thermal Information

Symbols

TSTG

TL

PD

θJC

θJA

Parameter

Storage Temperature

Lead Soldering Temperature, 10 Seconds

Vapor Phase, 60 Seconds

Infrared, 15 Seconds

Power Dissipation, TA = 25°C

Thermal Resistance – Junction-to-Case

Thermal Resistance – Junction-to-Ambient(3)

Min.

-65

Typ.

37

100

Max.

150

300

215

220

715

Unit

°C

°C

°C

°C

mW

°C/W

°C/W

3. Junction-to-ambient thermal resistance, θJA, is a strong function of PCB material, board thickness, thickness and

number of copper planes, number of vias used, diameter of vias used, available copper surface, and attached heat

sink characteristics.

Recommended Operating Conditions

Symbols

Parameter

VCC

Supply Voltage

TA

Ambient Temperature

TJ

Junction Temperature

Conditions

VCC to GND

Commercial

Industrial

Min.

4.5

-10

-40

Typ.

5.0

Max.

5.5

85

85

125

Unit

V

°C

°C

°C

© 2006 Fairchild Semiconductor Corporation

FAN5099 Rev. 1.1.3

4

www.fairchildsemi.com

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