FS6127-01 查看數據表（PDF） - Unspecified

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比赛名单

FS6127-01

1:9 ZERO DELAY CLOCK BUFFER IC

Unspecified 

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February 1999

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5.0 Package Information

Table 7: 8-pin SOIC (0.150") Package Dimensions

DIMENSIONS

INCHES

MILLIMETERS

MIN. MAX. MIN. MAX.

A 0.061 0.068 1.55 1.73

A1 0.004 0.0098 0.102 0.249

A2 0.055 0.061 1.40 1.55

B 0.013 0.019 0.33 0.49

C 0.0075 0.0098 0.191 0.249

D 0.189 0.196 4.80 4.98

E 0.150 0.157 3.81 3.99

e

0.050 BSC

1.27 BSC

H 0.230 0.244 5.84 6.20

h 0.010 0.016 0.25 0.41

L 0.016 0.035 0.41 0.89

Θ

0°

8°

0°

8°

8

R

ÅÉ"ÇÅÃÇ"#)#$É#ˆÃDŽ

EH

1

ALL RADII:

0.005" TO 0.01"

B

e

A2 A

C

D

BASE

PLANE

A1

SEATING

PLANE

h x 45°

L

7° typ.

θ

Table 8: 8-pin SOIC (0.150") Package Characteristics

PARAMETER

Thermal Impedance, Junction to Free-Air

8-pin 0.150” SOIC

Lead Inductance, Self

Lead Inductance, Mutual

Lead Capacitance, Bulk

SYMBOL

CONDITIONS/DESCRIPTION

ΘJA

Air flow = 0 m/s

Corner lead

L11

Center lead

L12

Any lead to any adjacent lead

C11

Any lead to VSS

TYP.

110

2.0

1.6

0.4

0.27

UNITS

°C/W

nH

nH

pF

5

,62

2.4.99

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