G965 查看數據表（PDF） - Global Mixed-mode Technology Inc
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G965 Datasheet PDF : 9 Pages
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Global Mixed-mode Technology Inc.
G965
Absolute Maximum Ratings
(Note 1)
Input Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V
VEN Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . .VIN+0.3V
Power Dissipation Internally Limited
(Note 2)
Maximum Junction Temperature . . . . . . . . . . . . 150°C
Storage Temperature Range . . . . -65°C ≤TJ ≤ +150°C
Reflow Temperature (soldering, 10sec) . . .. . . 260°C
Thermal Resistance Junction to Ambient, (θJA)
SOT-223-5. . . . . . . . . . . . . . . . . . . . . . . . . . .141°C/W
SOP-8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .162°C/W
Thermal Resistance Junction to Case, (θJC)
SOT-223-5 . . . . . . . . . . . . . . . . . . . . . . . . . . . 20°C/W
SOP-8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31°C/W
ESD Rating (Human Body Model) . . . . . . . . . . . . 2kV
Operation Conditions
(Note 1)
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . 2.2V ~5.5V
Temperature Range . . . . . . . . . . . . -40°C ≤TA ≤ +85°C
Electrical Characteristics
VEN=VIN, VIN =5V, IO = 0.5A, CIN = 4.7μF, COUT =10μF, TA = TJ = 25°C unless otherwise specified (Note 3)
PARAMETER
Supply Voltage
Output Voltage
Line Regulation
Load Regulation
Quiescent Current
Ripple Rejection
Dropout Voltage
Short Circuit Current
Over Temperature
VEN Voltage High
VEN Voltage Low
VEN Bias Current Low
ADJ Reference Voltage
ADJ Pin Threshold
SYMBOL
CONDITION
VIN
VO
VIN=VO +0.7V, IO=10mA
VO+0.7V < VIN < 5.5V, IO=10mA
10mA < IO < 1.5A
IQ
VIN=3.3V,VEN=VIN
VIN=3.3V,VEN=0V
fi=120Hz, 1VP-P, IO=100mA
VD
IO=1.5A
VENH
VENL
IENL
VREF
Output Active
Output Disabled
VEN=0.4V
VIN=2.2V, VADJ=VOUT, IO=10mA
MIN
2.2
-2
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1.6
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1.188
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TYP
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VO
0.2
0.8
1.7
16
55
0.5
0.8
150
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1.2
0.2
MAX
5.5
2
2
2
2.5
35
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0.65
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0.4
20
1.212
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UNIT
V
%
%
%
mA
μA
dB
V
A
°C
V
V
μA
V
V
Note 1:
Note2:
Note3:
Note4:
Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are
conditions under which the device functions but the specifications might not be guaranteed. For guaranteed specifications
and test conditions see the Electrical Characteristics.
The maximum power dissipation is a function of the maximum junction temperature, TJmax ; total thermal resistance,
θJA, and ambient temperature TA. The maximum allowable power dissipation at any ambient temperature is (Tjmax-TA) /
θJA. If this dissipation is exceeded, the die temperature will rise above 150°C and IC will go into thermal shutdown.
Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible.
The type of output capacitor should be tantalum or aluminum.
Definitions
Dropout Voltage
The input/output Voltage differential at which the regula-
tor output no longer maintains regulation against further
reductions in input voltage. Measured when the output
drops 2% below its nominal value, dropout voltage is
affected by junction temperature, load current and mini-
mum input supply requirements.
Line Regulation
The change in output voltage for a change in input volt-
age. The measurement is made under conditions of low
dissipation or by using pulse techniques such that aver-
age chip temperature is not significantly affected.
Load Regulation
The change in output voltage for a change in load
current at constant chip temperature. The measure-
ment is made under conditions of low dissipation or by
using pulse techniques such that average chip tem-
perature is not significantly affected.
Maximum Power Dissipation
The maximum total device dissipation for which the
regulator will operate within specifications.
Quiescent Bias Current
Current which is used to operate the regulator chip
and is not delivered to the load.
Ver: 1.7
Jan 08, 2007
TEL: 886-3-5788833
http://www.gmt.com.tw
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