FQG4904 查看數據表（PDF） - Fairchild Semiconductor
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FQG4904 Datasheet PDF : 12 Pages
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Electrical Characteristics (Continued)
Symbol
Parameter
Test Conditions
Type Min Typ Max Units
Drain-Source Diode Characteristics and Maximum Ratings
IS
Maximum Continuous Drain-Source Diode Forward Current
N-Ch --
P-Ch --
-- 0.46 A
-- -0.46 A
ISM
Maximum Pulsed Drain-Source Diode Forward Current
N-Ch --
P-Ch --
-- 3.68 A
-- -3.68 A
VSD
Drain-Source Diode Forward Voltage VGS = 0 V, IS = 0.46 A
VGS = 0 V, IS = -0.46 A
N-Ch --
-- 1.4
V
P-Ch --
-- -5.0
V
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
VGS = 0 V, IS = 0.46 A,
dIF / dt = 100 A/µs (Note 3)
N-Ch
--
--
104
248
--
--
ns
nC
VGS = 0 V, IS = -0.46 A,
dIF / dt = 100 A/µs (Note 3)
P-Ch
--
--
117
497
--
--
ns
nC
Notes:
1. Repetitive Rating : Pulse width limited by maximum junction temperature
2. ISD ≤ 0.46A, di/dt ≤ 200A/µs, VDD ≤ BVDSS, Starting TJ = 25°C
3. Pulse Test : Pulse width ≤ 300µs, Duty cycle ≤ 2%
4. Essentially independent of operating temperature
5. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance. RθCA is determined by the user’s board design
Maximum RθJA using the different board layouts on 3”x4.5” FR-4 PCB in a still air environment :
a. 78°C/W when mounted without any pad copper
b. 60°C/W when mounted on a 4.5 in2 pad of 2oz copper. In such an environment, the power dissipation can be enhanced up to 2.1W
©2002 Fairchild Semiconductor Corporation
Rev. A1, April 2002
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