5962F9568904VEC 查看數據表（PDF） - Intersil

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5962F9568904VEC

Radiation Hardened 3.3V Quad Differential Line Receiver

Intersil 

HS-26CLV32RH, HS-26CLV32EH

Die Characteristics

DIE DIMENSIONS:

78 mils x 123 mils x 21 mils

(1970µm x 3120µm)

INTERFACE MATERIALS:

Glassivation:

Type: PSG (Phosphorus Silicon Glass)

Thickness: 8kÅ ±1kÅ

Substrate:

AVLSI1RA, Silicon backside, VDD backside potential

Metallization Mask Layout

HS-26CLV32RH, HS-26CLV32EH

AIN

VDD

BIN

(1)

(16)

(15)

AIN (2)

AOUT (3)

ENAB (4)

COUT (5)

CIN (6)

Metallization:

Bottom: Mo/TiW

Thickness: 5800Å ±1kÅ

Top: Al/Si/Cu

Thickness: 10kÅ ±1kÅ

Worst Case Current Density:

<2.0 x 105A/cm2

Bond Pad Size:

110µm x 100µm

TABLE 1. HS-26CLV32RH, HS-26CLV32EH PAD COORDINATES

PIN

NUMBER

PAD

NAME

RELATIVE TO PIN 1

X COORDINATES Y COORDINATES

1

AIN

0

0

2

(14) BIN

3

4

AIN

AOUT

ENABLE

-337.1

-337.1

-337.1

-362

-912.5

-1319.3

5

6

(13) BOUT

7

COUT

CIN

CIN

-337.1

-337.1

0

-1774.4

-2233.7

-2595.7

8

GND

418.4

-2596.7

9

DIN

776.4

-2595.7

(12) ENAB

10

DIN

1113.5

-2233.7

11

DOUT

12

ENABLE

1113.5

1113.5

-1774.4

-1319.3

13

(11) DOUT

14

BOUT

BIN

1113.5

1113.5

-898.4

-362

15

BIN

776.4

0

16

VDD

420.2

1

(10) DIN NOTE: Dimensions in microns

(7)

(8)

(9)

CIN

GND

DIN

For additional products, see www.intersil.com/product_tree

Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted

in the quality certifications found at www.intersil.com/design/quality

Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time

without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be

accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third

parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.

For information regarding Intersil Corporation and its products, see www.intersil.com

3

FN4907.4

January 8, 2013

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