HSP3824 查看數據表（PDF） - Harris Semiconductor
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HSP3824 Datasheet PDF : 41 Pages
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HSP3824
Thin Plastic Quad Flatpack Packages (TQFP)
D
1Q48.7x7 (JEDEC MO-136AE ISSUE C)
D1
48 LEAD THIN PLASTIC QUAD FLATPACK PACKAGE
-D-
INCHES
MILLIMETERS
SYMBOL MIN
MAX
MIN
MAX NOTES
A
-
0.047
-
1.20
-
A1
0.002 0.005 0.05
0.15
-
A2
0.038 0.041 0.95
1.05
-
-A-
-B-
B
0.007 0.010 0.17
0.27
6
E E1
B1
0.007 0.009 0.17
0.23
-
D
0.347 0.362 8.80
9.20
3
D1
0.268 0.283 6.80
7.20
4, 5
E
0.347 0.362 8.80
9.20
3
E1
0.268 0.283 6.80
7.20
4, 5
e
L
0.018 0.029 0.45
0.75
-
PIN 1
N
48
e
0.020 BSC
48
7
0.50 BSC
-
SEATING
-H-
A PLANE
Rev. 0 4/95
NOTES:
0.08
0.003
-C-
1. Controlling dimension: MILLIMETER. Converted inch
dimensions are not necessarily exact.
2. All dimensions and tolerances per ANSI Y14.5M-1982.
GAGE
PLANE
0.020
0.008 MIN
0o MIN
L
0o-7o 0.25
0.010
11o-13o
0.08
0.003
M
C
A-B S
DS
B
B1
0.09/0.16
A2 A1 0.004/0.006
11o-13o
BASE METAL
WITH PLATING
0.09/0.20
0.004/0.008
3. Dimensions D and E to be determined at seating plane -C- .
4. Dimensions D1 and E1 to be determined at datum plane -H- .
5. Dimensions D1 and E1 do not include mold protrusion.
Allowable protrusion is 0.25mm (0.010 inch) per side.
6. Dimension B does not include dambar protrusion. Allowable
dambar protrusion shall not cause the lead width to exceed the
maximum B dimension by more than 0.08mm (0.003 inch).
7. “N” is the number of terminal positions.
41
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