HSP061-2N4(2012) 查看數據表（PDF） - STMicroelectronics

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HSP061-2N4
(Rev.:2012)

2-line ESD protection for high speed lines

STMicroelectronics 

HSP061-2

3

Package information

Package information

● Epoxy meets UL94, V0

● Lead-free package

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK® is an ST trademark.

Table 3. SOT-666 dimensions

b1

L1

L3

b

D

A

E1

L2

E

A3

e

Dimensions

Ref.

Millimeters

Inches

Min. Typ. Max. Min. Typ. Max.

A 0.45

0.60 0.018

0.024

A3 0.08

0.18 0.003

0.007

b 0.17

0.34 0.007

0.013

b1 0.19 0.27 0.34 0.007 0.011 0.013

D 1.50

1.70 0.059

0.067

E 1.50

1.70 0.059

0.067

E1 1.10

1.30 0.043

0.051

e

0.50

0.020

L1

0.19

0.007

L2 0.10

0.30 0.004

0.012

L3

0.10

0.004

Figure 11. Footprint recommendations

dimensions in mm (inches)

0.50

(0.019)

Figure 12. Marking

0.99

(0.039)

0.62 2.60

(0.024) (0.01)

0.30

(0.012)

R

Doc ID 022777 Rev 1

5/12

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