HSP061-4M10(2012) 查看數據表（PDF） - STMicroelectronics

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HSP061-4M10
(Rev.:2012)

4-line ESD protection for high speed lines

STMicroelectronics 

HSP061-4M10

Recommendation on PCB assembly

4

Recommendation on PCB assembly

Figure 12. Recommended stencil window position

10 µm

10 µm

15 µm

5 µm

Copper

Thickness:

100 µm

Stencil window

Footprint

5 µm

15 µm

380 µm

400 µm

15 µm

190 µm

200 µm

15 µm

4.1

Solder paste

1. Use halide-free flux, qualification ROL0 according to ANSI/J-STD-004.

2. “No clean” solder paste recommended.

3. Offers a high tack force to resist component displacement during PCB movement.

4. Use solder paste with fine particles: powder particle size 20-45 µm.

Doc ID 023716 Rev 2

7/11

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