IS22C012 查看數據表（PDF） - Integrated Silicon Solution
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IS22C012 Datasheet PDF : 12 Pages
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IS22C012
PIN CONFIGURATIONS
300-mil PDIP
OUT1 1
VOUT1 2
VOUT2 3
GND 4
OUT2 5
OUT3 6
COUT 7
OSC 8
16 IRP
15 SBT
14 S4
13 S3
12 VCC
11 S2
10 S1
9 VPP
ISSI ®
PIN DESCRIPTION
OUT1 Programmable output 1
OUT2 Programmable output 2
OUT3 Programmable output 3
VOUT1
PWM audio signal output for buzzer and speaker
VOUT2
GND
PWM audio signal output for buzzer and speaker
Power ground
COUT
OSC
Current output from internal DAC for speaker playback
Oscillator resistor pin to control sampling frequency
VPP
Program power supply, no connect when voice playback
S1
Trigger switch 1, internal pull low, active high
S2
Trigger switch 2, internal pull low, active high
VCC
Positive power supply
S3
Trigger switch 3, internal pull low, active high
S4
Trigger switch 4, internal pull low, active high
SBT
Sequential trigger, internal pull low, active high
IRP
Interrupt to stop playback, internal pull low, active high
Note:
1. The following pins are used to program data into the memory: pins 4, 5, 6,
8, 9, 12, 15 and 16.
BONDING DIAGRAM
12 11 10 9 8 7
Y
X
(0,0)
65
NC
13 14 15 16 NC 1 2
34
Note: Substrate must be connected to GND
Pad size = 80 µm x 80 µm
Die size = 2128 x 1635 µm
83.78 x 64.37 mil
Note: Programming requires connection to
pins 4, 5, 6, 8, 9, 12, 15, and 16.
4
BONDING PARAMETERS
Pin
Name
1
OUT1
2
VOUT1
3
VOUT2
4
GND
5
OUT2
6
OUT3
7
COUT
8
OSC
9
VPP
10
S1
11
S2
12
VCC
13
S3
14
S4
15
SBT
16
IRP
X
204
423
718
893
786
590
167
–89
–306
–483
–691
–899
–796
–588
–380
–172
Y
–678
–678
–678
–678
677
677
677
677
677
677
677
677
–678
–678
–678
–678
Integrated Silicon Solution, Inc. — 1-800-379-4774
ADVANCE INFORMATION VP010-0B
02/24/99
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