ISL59483 查看數據表（PDF） - Intersil

零件编号

产品描述 (功能)

比赛名单

ISL59483

Dual, 500MHz Triple, Multiplexing Amplifiers

Intersil 

ISL59483

Typical Performance Curves VS = ±5V, RL = 500Ω to GND, TA = +25°C, unless otherwise specified. (Continued)

HIZ

50Ω

TERM.

VIN = 0V

HIZ

50Ω

TERM.

VIN = 0V

0

0

VOUT A, B, C

10ns/DIV

FIGURE 36. MUX 1: HIZ SWITCHING GLITCH VIN = 0V

0

0

VOUT A, B, C

20ns/DIV

FIGURE 37. MUX 2: HIZ SWITCHING GLITCH VIN = 0V

HIZ

50Ω

TERM.

VIN=1V

0

VOUT A, B, C

0

10ns/DIV

FIGURE 38. MUX 1: HIZ TRANSIENT RESPONSE VIN = 1V

JEDEC JESD51-7 HIGH EFFECTIVE THERMAL

CONDUCTIVITY TEST BOARD - QFN EXPOSED

DIEPAD SOLDERED TO PCB PER JESD51-5

6

5

4.34W

4

3

QFN48

θJA = +23°C/

2

1

0

0

25

50

75 85 100 125 150

AMBIENT TEMPERATURE (°C)

FIGURE 40. PACKAGE POWER DISSIPATION vs AMBIENT

TEMPERATURE

11

HIZ

50Ω

TERM.

VIN = 1V

0

VOUT A, B, C

0

20ns/DIV

FIGURE 39. MUX 2: HIZ TRANSIENT RESPONSE VIN = 1V

JEDEC JESD51-3 LOW EFFECTIVE THERMAL

CONDUCTIVITY TEST BOARD - QFN EXPOSED

DIEPAD SOLDERED TO PCB PER JESD51-5

1.2

1.0

870mW

0.8

0.6

QFN48

θJA =+ 115°C/

0.4

0.2

0.0

0

25

50

75 85 100 125 150

AMBIENT TEMPERATURE (°C)

FIGURE 41. PACKAGE POWER DISSIPATION vs AMBIENT

TEMPERATURE

FN6394.2

May 21, 2007

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