ISL6292B 查看數據表（PDF） - Intersil

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ISL6292B

Li-ion/Li Polymer Battery Charger

Intersil 

ISL6292B

Board Layout Recommendations

The ISL6292B is targeted for space-limited applications. In

order to maximize the current capability, it is very important

that the exposed pad under the package is properly soldered

to the board and is connected to other layers through

thermal vias. More thermal vias and more copper attached to

the exposed pad usually result in better thermal

performance. On the other hand, the number of vias is

limited by the size of the pad. The exposed pads for the 4x4

QFN package are able to have 5 vias. As much copper as

possible should be connected to the exposed pad to

minimize the thermal impedance. Refer to the ISL6292B

evaluation board for layout examples.

11

FN9139 .1

April 19, 2005

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