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AIC1570CS 查看數據表(PDF) - Analog Intergrations

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AIC1570CS Datasheet PDF : 18 Pages
First Prev 11 12 13 14 15 16 17 18
AIC1570
+12V
+3.3VIN
+
Q3
VOUT3
+
COUT3
+
COUT2
Css
+
VCC
VIN2
GATE3
VOUT2
SS
GND
OCSET
UGATE
PHASE
LGATE
PGND
+5VIN
+
Q1
CIN
LOUT
+
VOUT
COUT
Q2
Power Plane Layer
Circuit Plane Layer
Via Connection to Ground Plane
Fig. 11 Printed circuit board power planes and islands
A multi-layer printed circuit board is
recommended. Figure 11 shows the connections
of the critical components in the converter. The
CIN and COUT could each represent numerous
physical capacitors. Dedicate one solid layer for a
ground plane and make all critical component
ground connections with vias to this layer.
PWM Output Capacitors
The load transient for the microprocessor core
requires high quality capacitors to supply the high
slew rate (di/dt) current demand.
The ESR (equivalent series resistance) and ESL
(equivalent series inductance) parameters rather
than actual capacitance determine the buck
capacitor values. For a given transient load
magnitude, the output voltage transient change
due to the output capacitor can be note by the
following equation:
VOUT
=
ESR
×
IOUT
+
ESL
×
IOUT
T
,
where
IOUT is transient load current step.
After the initial transient, the ESL dependent term
drops off. Because the strong relationship
between output capacitor ESR and output load
transient, the output capacitor is usually chosen
for ESR, not for capacitance value. A capacitor
with suitable ESR will usually have a larger
capacitance value than is needed for energy
storage.
A common way to lower ESR and raise ripple
current capability is to parallel several capacitors.
In most case, multiple electrolytic capacitors of
small case size are better than a single large
14

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