LIS3DHTR 查看數據表（PDF） - STMicroelectronics

零件编号

产品描述 (功能)

比赛名单

LIS3DHTR

MEMS digital output motion sensor ultra low-power high performance 3-axes “nano” accelerometer

STMicroelectronics 

Application hints

4

Application hints

Figure 5. LIS3DH electrical connection

ADC1 ADC2

Vdd

LIS3DH

10µF

Vdd_IO

100nF

16

1

14

13

TOP VIEW

5

6

9

8

ADC3

INT1

INT2

Vdd_IO

Rpu Rpu

4.1

GND

Pull-up to be added

when I2C interface is used

Digital signal from/to signal controller.Signal’s levels are defined by proper selection of Vdd_IO

The device core is supplied through Vdd line while the I/O pads are supplied through

Vdd_IO line. Power supply decoupling capacitors (100 nF ceramic, 10 µF aluminum) should

be placed as near as possible to the pin 14 of the device (common design practice).

All the voltage and ground supplies must be present at the same time to have proper

behavior of the IC (refer to Figure 5). It is possible to remove Vdd maintaining Vdd_IO

without blocking the communication bus, in this condition the measurement chain is

powered off.

The functionality of the device and the measured acceleration data is selectable and

accessible through the I2C or SPI interfaces.When using the I2C, CS must be tied high.

The ADC1, ADC2 & ADC3 if not used can be left floating or keep connected to Vdd or GND.

The functions, the threshold and the timing of the two interrupt pins (INT1 and INT2) can be

completely programmed by the user through the I2C/SPI interface.

Soldering information

The LGA package is compliant with the ECOPACK®, RoHS and “Green” standard.

It is qualified for soldering heat resistance according to JEDEC J-STD-020.

Leave “Pin 1 Indicator” unconnected during soldering.

Land pattern and soldering recommendations are available at www.st.com.

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Doc ID 17530 Rev 1

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