LT3024IFE 查看數據表（PDF） - Linear Technology

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比赛名单

LT3024IFE

Dual 100mA/500mA Low Dropout, Low Noise, Micropower Regulator

Linear Technology 

LT3024

PACKAGE DESCRIPTION

DE/UE Package

12-Lead Plastic DFN (4mm × 3mm)

(Reference LTC DWG # 05-08-1695 Rev D)

3.60 ±0.05

2.20 ±0.05

3.30 ±0.05

1.70 ± 0.05

0.70 ±0.05

PACKAGE OUTLINE

0.25 ± 0.05

0.50 BSC

2.50 REF

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED

4.00 ±0.10

(2 SIDES)

PIN 1

TOP MARK

(NOTE 6)

0.200 REF

R = 0.05

TYP

3.00 ±0.10

(2 SIDES)

0.75 ±0.05

0.00 – 0.05

R = 0.115

7

TYP

0.40 ± 0.10

12

3.30 ±0.10

1.70 ± 0.10

6

0.25 ± 0.05

2.50 REF

1

0.50 BSC

BOTTOM VIEW—EXPOSED PAD

PIN 1 NOTCH

R = 0.20 OR

0.35 × 45°

CHAMFER

(UE12/DE12) DFN 0806 REV D

NOTE:

1. DRAWING PROPOSED TO BE A VARIATION OF VERSION

(WGED) IN JEDEC PACKAGE OUTLINE M0-229

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION

ON THE TOP AND BOTTOM OF PACKAGE

3024fa

18

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