LT3029 查看數據表（PDF） - Linear Technology

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产品描述 (功能)

比赛名单

LT3029

Dual 500mA/500mA Low Dropout, Low Noise, Micropower Linear Regulator

Linear Technology 

PACKAGE DESCRIPTION

DE Package

16-Lead Plastic DFN (4mm × 3mm)

(Reference LTC DWG # 05-08-1732 Rev Ø)

LT3029

0.70 ±0.05

3.60 ±0.05

2.20 ±0.05

3.30 ±0.05

1.70 ± 0.05

PACKAGE

OUTLINE

3.15 REF

0.25 ± 0.05

0.45 BSC

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED

4.00 ±0.10

(2 SIDES)

9

R = 0.05

TYP

R = 0.115

TYP

0.40 ± 0.10

16

PIN 1

TOP MARK

(SEE NOTE 6)

0.200 REF

3.00 ±0.10

(2 SIDES)

0.75 ±0.05

0.00 – 0.05

3.30 ±0.10

1.70 ± 0.10

8

3.15 REF

PIN 1 NOTCH

R = 0.20 OR

0.35 × 45°

CHAMFER

(DE16) DFN 0806 REV Ø

1

0.23 ± 0.05

0.45 BSC

BOTTOM VIEW—EXPOSED PAD

NOTE:

1. DRAWING PROPOSED TO BE MADE VARIATION OF VERSION (WGED-3) IN JEDEC

PACKAGE OUTLINE MO-229

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE

TOP AND BOTTOM OF PACKAGE

3029fa

17

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