datasheetbank_Logo
数据手册搜索引擎和 Datasheet免费下载 PDF

LT3060 查看數據表(PDF) - Linear Technology

零件编号
产品描述 (功能)
比赛名单
LT3060 Datasheet PDF : 20 Pages
First Prev 11 12 13 14 15 16 17 18 19 20
LT3060
PACKAGE DESCRIPTION
DC Package
8-Lead Plastic DFN (2mm × 2mm)
(Reference LTC DWG # 05-08-1719 Rev Ø)
2.55 ±0.05
1.15
±0.05
0.64 ±0.05
(2 SIDES)
0.70 ±0.05
PACKAGE
OUTLINE
1.37 ±0.05
(2 SIDES)
0.25 ± 0.05
0.45 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
R = 0.05
TYP
R = 0.115
TYP
5
8
0.40 ± 0.10
PIN 1 BAR
TOP MARK
(SEE NOTE 6)
0.200 REF
2.00 ±0.10 0.64 ± 0.10
(4 SIDES) (2 SIDES)
0.75 ±0.05
PIN 1 NOTCH
R = 0.20 OR
0.25 s 45°
CHAMFER
(DC8) DFN 0106 REVØ
4
1
0.23 ± 0.05
0.45 BSC
1.37 ±0.10
(2 SIDES)
0.00 – 0.05
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
3060f
18

Share Link: 

datasheetbank.com [ Privacy Policy ] [ Request Datasheet ] [ Contact Us ]