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LT3782(RevF) 查看數據表(PDF) - Linear Technology

零件编号
产品描述 (功能)
比赛名单
LT3782
(Rev.:RevF)
Linear
Linear Technology Linear
LT3782 Datasheet PDF : 20 Pages
First Prev 11 12 13 14 15 16 17 18 19 20
LT3782
APPLICATIONS INFORMATION
2. Power MOSFET switching and conduction losses:


IO(MAX)
2

PFET
=


1–
2
DMAX


• RDS(ON) • DMAX T
IO(MAX)
+k
VO2
2
1– DMAX
• CRSS
f
3. The I2R losses in the sense resistor can be calculated
almost by inspection.
PR(SENSE)
=




IO(MAX)
2
1– DMAX
2



R
DMAX
4. The losses in the inductor are simply the DC input cur-
rent squared times the winding resistance. Expressing
this loss as a function of the output current yields:


IO(MAX)
2

PR(
WINDING)
=


1–
2
DMAX


•RW
5. Losses in the boost diode. The power dissipation in the
boost diode is:
PDIODE
=
IO(MAX )
2
VD
The boost diode can be a major source of power loss
in a boost converter. For 13.2V input, 42V output at 3A,
a Schottky diode with a 0.4V forward voltage would
dissipate 600mW, which represents about 1% of the
input power. Diode losses can become significant at
low output voltages where the forward voltage is a
significant percentage of the output voltage.
6. Other losses, including CIN and CO ESR dissipation and
inductor core losses, generally account for less than
2% of the total losses.
PCB Layout Considerations
To achieve best performance from an LT3782 circuit, the
PC board layout must be carefully done. For lower power
applications, a two-layer PC board is sufficient. However,
at higher power levels, a multiplayer PC board is recom-
mended. Using a solid ground plane under the circuit is
the easiest way to ensure that switching noise does not
affect the operation.
In order to help dissipate the power from MOSFETs and
diodes, keep the ground plane on the layers closest to the
layers where power components are mounted. Use power
planes for MOSFETs and diodes in order to improve the
spreading of the heat from these components into the
PCB.
3782ff
15

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