LTC4077
ELECTRICAL CHARACTERISTICS The ● denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. VDCIN = 5V, VUSBIN = 5V unless otherwise noted.
SYMBOL
IC/2
ITRIKL
VTRIKL
VUVDC
VUVUSB
VASD-DC
VASD-USB
VEN
REN
VHPWR
RHPWR
V⎯C⎯H⎯R⎯G
V⎯P⎯W⎯R
ΔVRECHRG
tRECHRG
tTERMINATE
tSS
RON-DC
RON-USB
TLIM
PARAMETER
Charge Current Termination Threshold
Trickle Charge Current
Trickle Charge Threshold Voltage
DCIN Undervoltage Lockout Voltage
USBIN Undervoltage Lockout Voltage
VDCIN – VBAT Lockout Threshold
VUSBIN – VBAT Lockout Threshold
EN Input Threshold Voltage
EN Pulldown Resistance
HPWR Input Threshold Voltage
HPWR Pulldown Resistance
⎯C⎯H⎯R⎯G Output Low Voltage
⎯P⎯W⎯R Output Low Voltage
Recharge Battery Threshold Voltage
Recharge Comparator Filter Time
Termination Comparator Filter Time
Soft-Start Time
Power FET “ON” Resistance
(Between DCIN and BAT)
Power FET “ON” Resistance
(Between USBIN and BAT)
Junction Temperature in
Constant-Temperature Mode
CONDITIONS
HPWR = 0V (Note 8)
VBAT < VTRIKL; RIDC = 1.25k
VBAT < VTRIKL; RIUSB = 2.1k
VBAT < VTRIKL; RIUSBL = 4k
VBAT Rising
Hysteresis
From Low to High
Hysteresis
From Low to High
Hysteresis
VDCIN from Low to High, VBAT = 4.2V
VDCIN from High to Low, VBAT = 4.2V
VUSBIN from Low to High
VUSBIN from High to Low
I⎯C⎯H⎯R⎯G = 5mA
I⎯P⎯W⎯R = 5mA
VFLOAT – VRECHRG, 0°C < TA < 85°C
VBAT from High to Low
IBAT Drops Below Termination Threshold
IBAT = 0 to Full-Scale
MIN TYP MAX UNITS
● 0.45
0.5
0.55 mA/mA
60
80
100
mA
30
47.5
65
mA
17
25
33
mA
2.8
2.9
3
V
100
mV
4
4.15
4.3
V
200
mV
3.8
3.95
4.1
V
200
mV
140
180
220
mV
20
50
80
mV
140
180
220
mV
20
50
80
mV
0.4
0.7
1
V
●1
2
5
MΩ
0.4
0.7
1
V
●1
2
5
MΩ
0.35
0.6
V
0.35
0.6
V
65
100
135
mV
3
6
10
ms
0.8
1.5
2.2
ms
175
250
325
µs
400
mΩ
550
mΩ
105
°C
Note 1: Absolute Maximum Ratings are those values beyond which the life
of a device may be impaired.
Note 2: The LTC4077E is guaranteed to meet the performance
specifications from 0°C to 70°C. Specifications over the –40°C to 85°C
operating temperature range are assured by design, characterization and
correlation with statistical process controls.
Note 3: Failure to correctly solder the exposed backside of the package to
the PC board will result in a thermal resistance much higher than 40°C/W.
See Thermal Considerations.
Note 4: Supply current includes IDC pin current (approximately 100µA)
but does not include any current delivered to the battery through the BAT
pin.
Note 5: Supply current includes IUSB and IUSBL pin currents
(approximately 100µA each) but does not include any current delivered to
the battery through the BAT pin.
Note 6: Guaranteed by long term current density limitations.
Note 7: IC/10 is expressed as a fraction of measured full charge current.
Note 8: IC/2 is expressed as a fraction of measured full charge current.
Note 9: VCC is greater of DCIN or USBIN
4077f
3