datasheetbank_Logo
数据手册搜索引擎和 Datasheet免费下载 PDF

LTC4075HVXEDD 查看數據表(PDF) - Linear Technology

零件编号
产品描述 (功能)
比赛名单
LTC4075HVXEDD Datasheet PDF : 16 Pages
First Prev 11 12 13 14 15 16
PACKAGE DESCRIPTION
DD Package
10-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1699)
0.675 ±0.05
LTC4075HVX
R = 0.115
TYP
6
0.38 ± 0.10
10
3.50 ±0.05
1.65 ±0.05
2.15 ±0.05 (2 SIDES)
3.00 ±0.10 1.65 ± 0.10
(4 SIDES) (2 SIDES)
0.25 ± 0.05
0.50
BSC
2.38 ±0.05
(2 SIDES)
PIN 1
PACKAGE TOP MARK
OUTLINE (SEE NOTE 6)
0.200 REF
0.75 ±0.05
0.00 – 0.05
(DD10) DFN 1103
5
1
0.25 ± 0.05
0.50 BSC
2.38 ±0.10
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
4075hvxf
15

Share Link: 

datasheetbank.com [ Privacy Policy ] [ Request Datasheet ] [ Contact Us ]