LX1004(2005) 查看數據表（PDF） - Microsemi Corporation
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LX1004 Datasheet PDF : 7 Pages
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LX1004
PRODUCT DATABOOK 1996/1997
1.2V & 2.5V MICROPOWER VOLTAGE REFERENCES
PRODUCTION DATA SHEET
A B S O L U T E M A X I M U M R AT I N G S (Note 1)
Reverse Breakdown Current .................................................................................... 30mA
Forward Current ........................................................................................................ 10mA
Operating Temperature Range ....................................................................... 0°C to 70°C
Storage Temperature Range ...................................................................... -65°C to 150°C
Lead Temperature (soldering, 10 seconds) ............................................................. 300°C
Pb-free / RoHS Peak Package Solder Reflow Temp (40 second max. exposure) .............. 260°C (+0, -5)
Note 1. Values beyond which damage may occur. All voltages are specified with respect to
ground, and all currents are positive into the specified terminal
PACKAGE PIN OUTS
N/C 1.
N/C 2.
N/C 3 .
ANODE 4.
8. CATHODE
7. N/C
6. CATHODE
5. N/C
DM PACKAGE
(Top View)
100% Pb-free / RoHS Matte Tin Lead Finish
T H E R M A L D ATA
DM PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
LP PACKAGE:
165ºC/W
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
165ºC/W
The θJA numbers are guidelines for the thermal performance of the device/pc-board system.
All of the above assume no ambient airflow.
1. ANODE
2. CATHODE
3. N/C
LP PACKAGE
(Top View)
2
Copyright © 1996
Rev. 1.2a 8/04
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