Integrated
Circuit
Systems, Inc.
M2006-12A
VCSO BASED FEC CLOCK PLL WITH HITLESS
DEVICE PACKAGE - 9 x 9mm CERAMIC LEADLESS CHIP CARRIER
Mechanical Dimensions:
Refer to the SAW PLL application notes web page at
www.icst.com/products/appnotes/SawPllAppNotes.htm
for application notes, including recommended PCB
footprint, solder mask, and furnace profile.
Figure 7: Device Package - 9 x 9mm Ceramic Leadless Chip Carrier
M2006-12A Datasheet Rev 1.0
9 of 10
Revised 28Jul2004
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