Et r onT ec h
EM566168
Operating Mode
CS1# CS2 OE# WE# LB# UB# DQ0~DQ7 DQ8~DQ15
Mode
H H X X X X High-Z
High-Z Deselect
X L X X X X High-Z
High-Z Deselect
L H X X H H High-Z
High-Z Deselect
L H H H L X High-Z
High-Z Output Disabled
LHHHX L
High-Z
High-Z Output Disabled
LHLHLH
D-out
High-Z Lower Byte Read
L H L H H L High-Z
D-out Upper Byte Read
LHLHL L
D-out
D-out Word Read
LHX L LH
D-in
High-Z Lower Byte Write
L H X L H L High-Z
D-in Upper Byte Write
LHX L L L
D-in
D-in Word Write
Note: X=don’t care. H=logic high. L=logic low.
Power
Standby
Deep Power Down
Standby
Active
Active
Active
Active
Active
Active
Active
Active
Absolute Maximum Ratings1)
Supply voltage, VCC
Input voltages, VIN
Input and output voltages, VIN, VOUT
Output short circuit current ISH
Operating temperature, TA
Storage temperature, TSTRG
Soldering Temperature (10s), TSOLDER
Power dissipation, PD
-0.2 to +3.6V
-0.2 to VCC + 0.3V
-2.0 to +3.6V*
100 mA
-25 to +85°C
-65 to +125°C
240°C
1W
Note: Absolute maximum DC requirements contains stress ratings only. Functional operation at the absolute
maximum limits is not implied or guaranteed. Extended exposure to maximum ratings may affect device
reliability.
Recommended DC Operating Conditions
Symbol
Parameter
Min.
VCC
Power Supply Voltage
VSS
Ground
VIH
Input High Voltage
VIL
Input Low Voltage
2.7
0
2.2
-0.22)
Notes:
1. Overshoot: VCC + 2.0V in case of pulse width ≤ 20ns
2. Undershoot: -2.0V in case of pulse width ≤ 20ns
3. Overshoot and undershoot are sampled, not 100% tested.
Typ.
3.0
−
−
−
Max.
3.3
0
VCC+0.21)
+0.6
Unit
V
V
V
V
Preliminary
3
Rev 0.2
Feb. 2002