MAAPSS0096 查看數據表（PDF） - Tyco Electronics
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MAAPSS0096 Datasheet PDF : 6 Pages
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1 Watt Power Amplifier
4.9 - 6.0 GHz
Application Information
Sample Board
1000006973
RoHS
Compliant
MAAPSS0096
V1
C1
R1
Plated Vias
Plated Vias
C2
Notes on board design
1. Sample board uses RO4350 (er = 3.48) as dielectric
for circuit board. Dielectric thickness is not critical
but RFin and RFout transmission lines should be 50
ohms (w = 22 mil for thickness = 10 mil).
2. Solder the exposed paddle on the back of the pack-
age to the board. Proper attachment of the exposed
paddle is essential for RF and DC ground in addition
to providing a low thermal resistance.
3. Case temperature (Tc) is measured on the top
circuit board metal as close to the body of the
package as possible (see sample board drawing).
4. The board must provide adequate heat sinking to
accommodate the 2.5 W typically dissipated under
small signal conditions. Sample board uses vias in
the vicinity of the ground pad to provide a suitable
heat sink connected to the ground plane of the
board as shown above.
5. Placement of C1, C2 and R1 are not critical but use
of size 1206 for the bypass caps (C1 and C2) is
critical.
3
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
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