MAX2021ETXT 查看數據表（PDF） - Maxim Integrated

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MAX2021ETXT

High-Dynamic-Range, Direct Up-/Downconversion 650MHz to 1200MHz Quadrature Mod/Demod

Maxim Integrated 

MAX2021

High-Dynamic-Range, Direct Up-/Downconversion

650MHz to 1200MHz Quadrature Mod/Demod

ABSOLUTE MAXIMUM RATINGS

VCC_ to GND ........................................................-0.3V to +5.5V

BBI+, BBI-, BBQ+, BBQ- to GND...............-3.5V to (VCC + 0.3V)

LO, RF to GND Maximum Current ......................................30mA

RF Input Power ...............................................................+30dBm

Baseband Differential I/Q Input Power...........................+20dBm

LO Input Power...............................................................+10dBm

RBIASLO1 Maximum Current .............................................10mA

RBIASLO2 Maximum Current .............................................10mA

RBIASLO3 Maximum Current .............................................10mA

Continuous Power Dissipation (Note 1) ...............................7.6W

Operating Case Temperature Range (Note 2) ....-40°C to +85°C

Maximum Junction Temperature .....................................+150°C

Storage Temperature Range .............................-65°C to +150°C

Lead Temperature (soldering, 10s) .................................+300°C

Soldering Temperature (reflow) .......................................+260°C

Note 1:

Note 2:

Based on junction temperature TJ = TC + (θJC x VCC x ICC). This formula can be used when the temperature of the

exposed pad is known while the device is soldered down to a PCB. See the Applications Information section for details.

The junction temperature must not exceed +150°C.

TC is the temperature on the exposed pad of the package. TA is the ambient temperature of the device and PCB.

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

PACKAGE THERMAL CHARACTERISTICS

TQFN

Junction-to-Ambient

Thermal Resistance (θJA) (Notes 3, 4) .......................+34°C/W

Junction-to-Case

Thermal Resistance (θJC) (Notes 1, 4) ......................+8.5°C/W

Note 3:

Note 4:

Junction temperature TJ = TA + (θJA x VCC x ICC). This formula can be used when the ambient temperature of the PCB is

known. The junction temperature must not exceed +150°C.

Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer

board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.

DC ELECTRICAL CHARACTERISTICS

(MAX2021 Typical Application Circuit, VCC = 4.75V to 5.25V, GND = 0V, I/Q inputs terminated into 50Ω to GND, LO input terminated into

50Ω, RF output terminated into 50Ω, 0V common-mode input, R1 = 432Ω, R2 = 619Ω, R3 = 332Ω, TC = -40°C to +85°C, unless otherwise

noted. Typical values are at VCC = 5V, TC = +25°C, unless otherwise noted.)

PARAMETER

SYMBOL

CONDITIONS

MIN TYP MAX UNITS

Supply Voltage

Total Supply Current

Total Power Dissipation

VCC

4.75 5.00 5.25

V

ITOTAL Pins 3, 13, 15, 31, 33 all connected to VCC

230

271

315

mA

1355 1654 mW

RECOMMENDED AC OPERATING CONDITIONS

PARAMETER

RF Frequency (Note 5)

LO Frequency (Note 5)

IF Frequency (Note 5)

LO Power Range

SYMBOL

fRF

fLO

fIF

PLO

CONDITIONS

MIN TYP MAX UNIT

650

1200 MHz

750

1200 MHz

550 MHz

-6

+3

dBm

2

Maxim Integrated

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