MAX2031ETP 查看數據表（PDF） - Maxim Integrated

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MAX2031ETP

High-Linearity, 650MHz to 1000MHz Upconversion/Downconversion Mixer with LO Buffer/Switch

Maxim Integrated 

High-Linearity, 650MHz to 1000MHz Upconversion/

Downconversion Mixer with LO Buffer/Switch

ABSOLUTE MAXIMUM RATINGS

VCC to GND ...........................................................-0.3V to +5.5V

RF (RF is DC shorted to GND through a balun)..................50mA

LO1, LO2 to GND ..................................................-0.3V to +0.3V

IF+, IF- to GND ...........................................-0.3V to (VCC + 0.3V)

TAP to GND ...........................................................-0.3V to +1.4V

LOSEL to GND ...........................................-0.3V to (VCC + 0.3V)

LOBIAS to GND..........................................-0.3V to (VCC + 0.3V)

RF, LO1, LO2 Input Power (Note 1) ...............................+20dBm

Continuous Power Dissipation (Note 2)....................................5W

θjA (Notes 3, 4)...............................................................+38°C/W

θjC (Notes 2, 3) ..............................................................+13°C/W

Operating Temperature Range (Note 5) .....TC = -40°C to +85°C

Junction Temperature ......................................................+150°C

Storage Temperature Range .............................-65°C to +150°C

Lead Temperature (soldering, 10s) .................................+300°C

Note 1: Maximum, reliable, continuous input power applied to the RF and IF port of this device is +12dBm from a 50Ω source.

Note 2: Based on junction temperature TJ = TC + (θJC x VCC x ICC). This formula can be used when the temperature of the exposed

pad is known while the device is soldered down to a PCB. See the Applications Information section for details. The junction

temperature must not exceed +150°C.

Note 3: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-

layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.

Note 4: Junction temperature TJ = TA + (θJA x VCC x ICC). This formula can be used when the ambient temperature of the PCB is

known. The junction temperature must not exceed +150°C.

Note 5: TC is the temperature on the exposed pad of the package. TA is the ambient temperature of the device and PCB.

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

DC ELECTRICAL CHARACTERISTICS

(Typical Application Circuit, VCC = 4.75V to 5.25V, no RF signals applied, TC = -40°C to +85°C. IF+ and IF- are DC grounded through an

IF balun. Typical values are at VCC = 5V, TC = +25°C, unless otherwise noted.)

PARAMETER

Supply Voltage

Supply Current

LOSEL Input-Logic Low

LOSEL Input-Logic High

SYMBOL

VCC

ICC

VIL

VIH

CONDITIONS

MIN TYP MAX UNITS

4.75 5.00 5.25

V

85 100

mA

0.8

V

2

V

RECOMMENDED AC OPERATING CONDITIONS

PARAMETER

SYMBOL

CONDITIONS

MIN TYP MAX UNITS

RF Frequency

Components tuned for the 700MHz band

(Table 1), C1 = 7pF, C5 = 3.3pF (Notes 6, 7)

650

fRF

Components tuned for the 800MHz/900MHz

cellular band (Table 1), C1 = 82pF,

800

C5 = 2.0pF (Note 6)

850

1000

MHz

LO Frequency

IF Frequency

LO Drive Level

fLO

(Notes 6, 7)

650

fIF

IF frequency range depends on external IF

transformer selection

0

PLO (Note 6)

-3

1250

250

+3

MHz

MHz

dBm

2 _______________________________________________________________________________________

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