MC100E256FN 查看數據表（PDF） - ON Semiconductor
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MC100E256FN Datasheet PDF : 8 Pages
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MC10E256, MC100E256
PACKAGE DIMENSIONS
PLCC–28
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 776–02
ISSUE E
Y BRK
-N-
B
0.007 (0.180) M T L -M S N S
U
0.007 (0.180) M T L -M S N S
D
Z
-L-
-M-
WD
V
28
1
X
VIEW D-D
G1
0.010 (0.250)
S T L -M S N S
A
0.007 (0.180) M T L -M S N S
H
0.007 (0.180) M T L -M S N S
Z
R
0.007 (0.180) M T L -M S N S
C
E
G
0.010 (0.250)
G1
S T L -M S N S
0.004 (0.100)
J
-T- SEATING
PLANE
VIEW S
NOTES:
1. DATUMS ĆLĆ, ĆMĆ, AND ĆNĆ DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.
2. DIM G1, TRUE POSITION TO BE MEASURED
AT DATUM ĆTĆ, SEATING PLANE.
3. DIM R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD
FLASH, BUT INCLUDING ANY MISMATCH
BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).
K1
K
F
VIEW S
0.007 (0.180) M T L -M S N S
INCHES
MILLIMETERS
DIM MIN MAX MIN MAX
A 0.485 0.495 12.32 12.57
B 0.485 0.495 12.32 12.57
C 0.165 0.180 4.20 4.57
E 0.090 0.110 2.29 2.79
F 0.013 0.019 0.33 0.48
G
0.050 BSC
1.27 BSC
H 0.026 0.032 0.66 0.81
J 0.020 Ċ 0.51 Ċ
K 0.025 Ċ 0.64 Ċ
R 0.450 0.456 11.43 11.58
U 0.450 0.456 11.43 11.58
V 0.042 0.048 1.07 1.21
W 0.042 0.048 1.07 1.21
X 0.042 0.056 1.07 1.42
Y
Ċ 0.020 Ċ 0.50
Z
2° 10° 2° 10°
G1 0.410 0.430 10.42 10.92
K1 0.040 Ċă 1.02 Ċă
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