MC14067B 查看數據表（PDF） - ON Semiconductor
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MC14067B Datasheet PDF : 10 Pages
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MC14067B
PACKAGE DIMENSIONS
PDIP−24
P SUFFIX
CASE 709−02
ISSUE C
24
1
H
G
A
F
D
13
B
12
NC
K
SEATING
PLANE
J
L
M
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D),
SHALL BE WITHIN 0.25 (0.010) AT MAXIMUM
MATERIAL CONDITION, IN RELATION TO
SEATING PLANE AND EACH OTHER.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
4. CONTROLLING DIMENSION: INCH.
INCHES
MILLIMETERS
DIM MIN MAX MIN MAX
A 1.235 1.265 31.37 32.13
B 0.540 0.560 13.72 14.22
C 0.155 0.200 3.94 5.08
D 0.014 0.022 0.36 0.56
F 0.040 0.060 1.02 1.52
G 0.100 BSC
2.54 BSC
H 0.065 0.080 1.65 2.03
J 0.008 0.015 0.20 0.38
K 0.115 0.135 2.92 3.43
L 0.600 BSC
15.24 BSC
M
0 _ 15_ 0 _ 15_
N 0.020 0.040 0.51 1.02
24
1
−T−
SEATING
PLANE
SOIC−24
DW SUFFIX
CASE 751E−04
ISSUE E
−A−
13
−B− 12X P
0.010 (0.25) M B M
12
24X D
J
0.010 (0.25) M T A S B S
F
22X G
C
M
K
R X 45 _
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 15.25 15.54 0.601 0.612
B 7.40 7.60 0.292 0.299
C 2.35 2.65 0.093 0.104
D 0.35 0.49 0.014 0.019
F 0.41 0.90 0.016 0.035
G
1.27 BSC
0.050 BSC
J 0.23 0.32 0.009 0.013
K 0.13 0.29 0.005 0.011
M 0_ 8_ 0_ 8_
P 10.05 10.55 0.395 0.415
R 0.25 0.75 0.010 0.029
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