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MC74VHC1G126DFT2 查看數據表(PDF) - ON Semiconductor

零件编号
产品描述 (功能)
比赛名单
MC74VHC1G126DFT2
ON-Semiconductor
ON Semiconductor ON-Semiconductor
MC74VHC1G126DFT2 Datasheet PDF : 6 Pages
1 2 3 4 5 6
MC74VHC1G126
MAXIMUM RATINGS
Symbol
Characteristics
Value
Unit
VCC
VIN
VOUT
DC Supply Voltage
DC Input Voltage
DC Output Voltage
IIK
IOK
IOUT
ICC
PD
qJA
TL
TJ
Tstg
VESD
Input Diode Current
Output Diode Current
DC Output Current, per Pin
DC Supply Current, VCC and GND
Power dissipation in still air
Thermal resistance
Lead temperature, 1 mm from case for 10 s
Junction temperature under bias
Storage temperature
ESD Withstand Voltage
VCC = 0
High or Low State
VOUT < GND; VOUT > VCC
SC−88A, TSOP−5
SC−88A, TSOP−5
Human Body Model (Note 1)
Machine Model (Note 2)
Charged Device Model (Note 3)
−0.5 to +7.0
−0.5 to +7.0
−0.5 to 7.0
−0.5 to VCC + 0.5
−20
+20
+25
+50
200
333
260
+150
−65 to +150
> 2000
> 200
N/A
V
V
V
mA
mA
mA
mA
mW
°C/W
°C
°C
°C
V
ILatchup Latchup Performance
Above VCC and Below GND at 125°C (Note 4)
±500
mA
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
1. Tested to EIA/JESD22−A114−A
2. Tested to EIA/JESD22−A115−A
3. Tested to JESD22−C101−A
4. Tested to EIA/JESD78
RECOMMENDED OPERATING CONDITIONS
Symbol
Characteristics
VCC
VIN
VOUT
TA
tr , tf
DC Supply Voltage
DC Input Voltage
DC Output Voltage
Operating Temperature Range
Input Rise and Fall Time
VCC = 3.3 V ± 0.3 V
VCC = 5.0 V ± 0.5 V
Min
Max
Unit
2.0
5.5
V
0.0
5.5
V
0.0
VCC
V
−55
+125
°C
0
100
ns/V
0
20
Device Junction Temperature versus
Time to 0.1% Bond Failures
Junction
Temperature °C
80
90
100
110
120
130
140
Time, Hours
1,032,200
419,300
178,700
79,600
37,000
17,800
8,900
Time, Years
117.8
47.9
20.4
9.4
4.2
2.0
1.0
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
1
1
10
100
1000
TIME, YEARS
Figure 3. Failure Rate vs. Time
Junction Temperature
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