MPVZ12G(2006) 查看數據表（PDF） - Freescale Semiconductor

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MPVZ12G
(Rev.:2006)

10 kPa Uncompensated Silicon Pressure Sensors

Freescale Semiconductor 

–A–

5

N –B–

8

S

J

K

PACKAGE DIMENSIONS

4

G

1

V

C

M

D 8 PL

0.25 (0.010) M T B S

W

PIN 1 IDENTIFIER

AS

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION A AND B DO NOT INCLUDE MOLD

PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).

5. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT.

H

–T–

INCHES

MILLIMETERS

DIM MIN MAX MIN MAX

A 0.415 0.425 10.54 10.79

B 0.415 0.425 10.54 10.79

C 0.500 0.520 12.70 13.21

D 0.038 0.042 0.96 1.07

G 0.100 BSC

2.54 BSC

H 0.002 0.010 0.05 0.25

J 0.009 0.011 0.23 0.28

K 0.061 0.071 1.55 1.80

M 0_ 7_ 0_ 7_

N 0.444 0.448 11.28 11.38

S 0.709 0.725 18.01 18.41

V 0.245 0.255 6.22 6.48

W 0.115 0.125 2.92 3.17

SEATING

PLANE

CASE 482A-01

ISSUE A

SMALL OUTLINE PACKAGE

–A–

5

N –B–

8

S

J

4

G

D 8 PL

0.25 (0.010) M T B S A S

1

DETAIL X

W

V

C

PIN 1

IDENTIFIER

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION A AND B DO NOT INCLUDE MOLD

PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).

5. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT.

6. DIMENSION S TO CENTER OF LEAD WHEN

FORMED PARALLEL.

INCHES

MILLIMETERS

DIM MIN MAX MIN MAX

A 0.415 0.425 10.54 10.79

B 0.415 0.425 10.54 10.79

C 0.500 0.520 12.70 13.21

D 0.026 0.034 0.66 0.864

G 0.100 BSC

2.54 BSC

J 0.009 0.011 0.23 0.28

K 0.100 0.120 2.54 3.05

M

0_ 15 _ 0 _ 15 _

N 0.444 0.448 11.28 11.38

S 0.540 0.560 13.72 14.22

V 0.245 0.255 6.22 6.48

W 0.115 0.125 2.92 3.17

M

DETAIL X

–T–

SEATING

PLANE

K

CASE 482C-03

ISSUE B

SMALL OUTLINE PACKAGE

MPVZ12

6

Sensors

Freescale Semiconductor

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