MPVZ7025GC6U 查看數據表（PDF） - Freescale Semiconductor

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MPVZ7025GC6U

Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated

Freescale Semiconductor 

Pressure

PACKAGE DIMENSIONS

2 PLACES 4 TIPS

0.006 (0.15) C A B

A

E

5

4

D

e

e/2

GAGE

PLANE

.014 (0.35) θ

L

A1

DETAIL G

8

F

B

N

P

1

E1

8X

DETAIL G

8X b

0.004 (0.1) M C A B

STYLE 1:

PIN 1. GND

2. +Vout

3. Vs

4. -Vout

5. N/C

6. N/C

7. N/C

8. N/C

STYLE 2:

PIN 1. N/C

2. Vs

3. GND

4. Vout

5. N/C

6. N/C

7. N/C

8. N/C

∅T

A

M

0.004 (0.1)

K

C

SEATING

PLANE

NOTES:

1. CONTROLLING DIMENSION: INCH.

2. INTERPRET DIMENSIONS AND TOLERANCES PER

ASME Y14.5M, 1994.

3. DIMENSIONS "D" AND "E1" DO NOT INCLUDE

MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR

PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152)

PER SIDE.

4. DIMENSION "b" DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM.

INCHES MILLIMETERS

DIM MIN MAX MIN MAX

A 0.370 0.390 9.39 9.91

A1 0.002 0.010 0.05 0.25

b 0.038 0.042 0.96 1.07

D 0.465 0.485 11.81 12.32

E 0.680 0.700 17.27 17.78

E1 0.465 0.485 11.81 12.32

e

0.100 BSC

2.54 BSC

F 0.240 0.260 6.10 6.60

K 0.115 0.135 2.92 3.43

L 0.040 0.060 1.02 1.52

M 0.270 0.290 6.86 7.37

N 0.160 0.180 4.06 4.57

P 0.009 0.011 0.23 0.28

T 0.110 0.130 2.79 3.30

θ

0˚

7˚

0˚

7˚

CASE 1351-01

ISSUE O

SMALL OUTLINE PACKAGE

MPXV7025

8

Sensors

Freescale Semiconductor

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