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NE713 查看數據表(PDF) - NEC => Renesas Technology

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NE713 Datasheet PDF : 16 Pages
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NE713
RECOMMENDED SOLDERING CONDITIONS
The following conditions (see table below) must be met when soldering this product.
Please consult with our sales offices in case other soldering process is used, or in case soldering is done under
different conditions.
<TYPES OF SURFACE MOUNT DEVICE>
For more details, refer to our document "SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL"
(C10535E)
[NE71383B]
Soldering process
Partial heating method
Soldering conditions
Terminal temperature: 230 °C or below, Flow time: 10 seconds or below,
Exposure limit*: None
Symbol
*: Exposure limit before soldering after dry-pack package is opened.
Storage conditions: 25 °C and relative humidity at 65 % or less.
Note: Do not apply more than a single process at once, except for "Partial heating method."
PRECAUTION: Avoid high static voltage and electric fields, because this device is Hetero Junction field effect
transistor with shottky barrier gate.
Caution
The Great Care must be taken in dealing with the devices in this guide.
The reason is that the material of the devices is GaAs (Gallium Arsenide), which is
designated as harmful substance according to the law concerned.
Keep the law concerned and so on, especially in case of removal.
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