PCA9515A 查看數據表（PDF） - NXP Semiconductors.

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PCA9515A

I2C-bus repeater

NXP Semiconductors. 

NXP Semiconductors

5. Pinning information

5.1 Pinning

PCA9515A

I2C-bus repeater

n.c. 1

8 VCC

SCL0 2

7 SCL1

PCA9515AD

SDA0 3

6 SDA1

GND 4

5 EN

002aad736

Fig 2. Pin configuration for SO8

n.c. 1

SCL0 2

SDA0 3

GND 4

PCA9515ADP

8 VCC

7 SCL1

6 SDA1

5 EN

002aad737

Fig 3. Pin configuration for TSSOP8

(MSOP8)

terminal 1

index area

SDA0 1

GND 2

EN 3

SDA1 4

PCA9515ATP

8 SCL0

7 n.c.

6 VCC

5 SCL1

002aag783

Transparent top view

Fig 4. Pin configuration for HWSON8

5.2 Pin description

Table 2.

Symbol

n.c.

SCL0

SDA0

GND

EN

Pin description

Pin

SO8, TSSOP8

1

2

3

4

5

HWSON8

7

8

1

2[1]

3

SDA1

6

4

SCL1

7

5

VCC

8

6

Description

not connected

serial clock bus 0; open-drain 5 V tolerant I/O

serial data bus 0; open-drain 5 V tolerant I/O

supply ground (0 V)

active HIGH repeater enable input

(internal pull-up with 100 k)

serial data bus 1; open-drain 5 V tolerant I/O

serial clock bus 1; open-drain 5 V tolerant I/O

supply voltage

[1] HWSON8 package die supply ground is connected to both GND pin and exposed center pad. GND pin

must be connected to supply ground for proper device operation. For enhanced thermal, electrical, and

board level performance, the exposed pad needs to be soldered to the board using a corresponding

thermal pad on the board and for proper head conduction through the board, thermal vias need to be

incorporated in the printed-circuit board in the thermal pad region.

PCA9515A

Product data sheet

All information provided in this document is subject to legal disclaimers.

Rev. 5 — 23 March 2012

© NXP B.V. 2012. All rights reserved.

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