PI3033B 查看數據表（PDF） - AMI Semiconductor

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PI3033B

Contact Image Sensor

AMI Semiconductor 

Preliminary PI3033B datasheet

PI3033B

200DPI CIS Sensor Chip

Engineering Data Sheet

Description:

Peripheral Imaging Corporation PI3033B CIS, Contact Image Sensor, chip is a 200 dot per

inch resolution, linear array image sensor chip. The sensor chip is processed with PIC’s

proprietary CMOS Image Sensing Technology. Designed for cascading multiple chips in a

series, the image sensor chips, using chip-on-board process, are bonded end-to-end on a

printed circuit board (PCB) in varying sensing array lengths. Accordingly offering image

reading widths to suit document scanners found in facsimile, scanner, check reader, and office

automation equipment.

Figure 1 is a block diagram of the imaging sensor chip. Each sensor chip consists of 64 detector

elements, their associated multiplexing switches, buffers, and a chip selector. The detector's element-

to-element spacing is approximately 125 um. The size of each chip without scribe lines is 7950 um by

500 um. Each sensor chip has 8 bonding pads. Only 7 are used to make the CIS Modules. The pad

symbols and functions are described in Table 1.

7950 m

Row of 64 Sensors

and Video Signal

Multiplexers

Readout Shift Register

500 m

Buffer

SP

Buffer

CP VDD DGND

Chip

Select

IOUT RSTLEV

Buffer

AGND EOS

Figure 1. PI3033B Block Diagram

SYMBOL

SP

CP

VDD

DGND

RSTLEV

IOUT

AGND

EOS

FUNCTION

Start Pulse: Input to start the line scan.

Clock Pulse: Input to clock the Shift Register.

Positive Supply: +5 volt supply connected to substrate.

Digital Ground: Connection topside common

A Bias Pad: Not used, left floating

Signal Current Output: Output for video signal current

Analog Ground: Connection topside common

End of Scan Pulse: Output from the shift register at end of scan.

Table 1. Pad Symbols and Functions

Page 2 of 13 Date: 03/18/05

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