SAF-XC822-1FRI 查看數據表（PDF） - Infineon Technologies

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SAF-XC822-1FRI

8-Bit Single-Chip Microcontroller

Infineon Technologies 

XC822/824

Electrical Parameters

Table 8

Input/Output Characteristics of XC822/XC824 (Operating Conditions

apply) (cont’d)

Parameter

Symbol

Limit Values Unit Test Conditions

Min. Max.

Pull-down current on IPDP CC –

20

port pins

150 –

μA VIL,max (5 V)

μA VIH,min (5 V)

–

5

μA VIL,max (3.3 V)

100 –

μA VIH,min (3.3 V)

Input leakage current IOZP CC -1

1

on port pins2)

Overload current on IOVP SR -5

5

any pin

μA 0 < VIN < VDDP,

TA ≤ 125 °C

mA 3)

Absolute sum of

overload currents

Σ|IOV| SR –

25

mA 3)

Voltage on any pin VPO

during VDDP power off

SR –

0.3

V

4)

Maximum current per IM

pin (excluding VDDP

and VSS)

SR -15 25

mA –

Maximum current

into VDDP

IMVDDP SR –

80

mA 3)

Maximum current out IMVSS SR –

of VSS

80

mA 3)

1) Not subjected to production test, verified by design/characterization. Hysteresis is implemented to avoid meta

stable states and switching due to internal ground bounce. It cannot be guaranteed that it suppresses switching

due to external system noise.

2) An additional error current (IINJ) will flow if an overload current flows through an adjacent pin.

3) Not subjected to production test, verified by design/characterization.

4) Not subjected to production test, verified by design/characterization. However, for applications with strict low

power-down current requirements, it is mandatory that no active voltage source is supplied at any GPIO pin

when VDDP is powered off.

Data Sheet

24

V1.2, 2011-10

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