SAF-XC835MT-2FGI 查看數據表（PDF） - Infineon Technologies

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SAF-XC835MT-2FGI

8-Bit Single-Chip Microcontroller

Infineon Technologies 

XC835/836

Package and Quality Declaration

4

Package and Quality Declaration

Chapter 4 provides the information of the XC835/836 package and reliability section.

4.1

Package Parameters

Table 24 provides the thermal characteristics of the packages used in XC835 and

XC836 respectively.

Table 24 Thermal Characteristics of the Packages

Parameter

Symbol

Limit Values Unit Package Types

Min. Max.

Thermal resistance junction RTJC CC -

case1)

-

30.8 K/W PG-DSO-24-1

27.0 K/W PG-TSSOP-28-1

-

20.2 K/W PG-TSSOP-28-12

Thermal resistance junction RTJL CC -

lead1)

-

30.5

195.3

K/W PG-DSO-24-1

K/W PG-TSSOP-28-1

-

41

K/W PG-TSSOP-28-12

1) The thermal resistances between the case and the ambient (RTCA) , the lead and the ambient (RTLA) are to be

combined with the thermal resistances between the junction and the case (RTJC), the junction and the lead

(RTJL) given above, in order to calculate the total thermal resistance between the junction and the ambient

(RTJA). The thermal resistances between the case and the ambient (RTCA), the lead and the ambient (RTLA)

depend on the external system (PCB, case) characteristics, and are under user responsibility.

The junction temperature can be calculated using the following equation: TJ=TA+RTJA × PD, where the RTJA is

the total thermal resistance between the junction and the ambient. This total junction ambient resistance RTJA

can be obtained from the upper four partial thermal resistances, by

a) simply adding only the two thermal resistances (junction lead and lead ambient), or

b) by taking all four resistances into account, depending on the precision needed.

Data Sheet

46

V1.2, 2011-03

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