SAF-XC858CA-16FFI5V 查看數據表（PDF） - Infineon Technologies

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SAF-XC858CA-16FFI5V

8-Bit Single-Chip Microcontroller

Infineon Technologies 

XC858CA

Package and Quality Declaration

5

Package and Quality Declaration

Chapter 5 provides the information of the XC858 package and reliability section.

5.1

Package Parameters

Table 48 provides the thermal characteristics of the PG-LQFP-64-4 package used in

XC858.

Table 48 Thermal Characteristics of the Packages

Parameter

Symbol

Limit Values

Unit Notes

Min.

Max.

Thermal resistance junction RTJC CC -

case1)

13.8

K/W -

Thermal resistance junction RTJL CC -

lead1)

34.6

K/W -

1) The thermal resistances between the case and the ambient (RTCA) , the lead and the ambient (RTLA) are to be

combined with the thermal resistances between the junction and the case (RTJC), the junction and the lead

(RTJL) given above, in order to calculate the total thermal resistance between the junction and the ambient

(RTJA). The thermal resistances between the case and the ambient (RTCA), the lead and the ambient (RTLA)

depend on the external system (PCB, case) characteristics, and are under user responsibility.

The junction temperature can be calculated using the following equation: TJ=TA+RTJA × PD, where the RTJA is

the total thermal resistance between the junction and the ambient. This total junction ambient resistance RTJA

can be obtained from the upper four partial thermal resistances, by

a) simply adding only the two thermal resistances (junction lead and lead ambient), or

b) by taking all four resistances into account, depending on the precision needed.

Data Sheet

114

V1.0, 2010-03

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