PCF50732H/F1 查看數據表（PDF） - Philips Electronics
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PCF50732H/F1 Datasheet PDF : 64 Pages
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Philips Semiconductors
Baseband and audio interface for GSM
Objective specification
PCF50732
CONTENTS
14
1
FEATURES
15
2
APPLICATIONS
16
3
GENERAL DESCRIPTION
17
4
ORDERING INFORMATION
18
5
QUICK REFERENCE DATA
18.1
18.2
6
BLOCK DIAGRAM
18.3
7
PINNING
18.4
8
FUNCTIONAL DESCRIPTION
18.5
18.6
8.1
General
8.2
Baseband and voice band reference voltages
9
BASEBAND CODEC
18.7
9.1
Baseband transmit path
18.8
9.2
Baseband receive path
19
9.3
Baseband Serial Interface (BSI)
19.1
10
VOICE BAND CODEC
19.2
10.1
Voice band receive path
20
10.2
Voice band transmit path
21
10.3
Voice band digital circuitry
21.1
11
AUXILIARY FUNCTIONS
11.1
Automatic Gain Control (AGC): AUXDAC1
21.2
11.2
Automatic Frequency Control (AFC):
21.3
AUXDAC2
21.4
11.3
Power ramping: AUXDAC3
21.5
11.4
Auxiliary analog-to-digital converter (AUXADC)
12
CONTROL SERIAL INTERFACE (CSI)
22
12.1
The serial interface
23
12.2
Control Serial Interface (CSI) timing
characteristics
12.3
Control register block
13
VOICE BAND SIGNAL PROCESSOR (VSP)
13.1
Hardware description
13.2
VSP assembler language
13.3
Descriptions of the VSP instruction set
13.4
The assembler/emulator
LIMITING VALUES
THERMAL CHARACTERISTICS
DC CHARACTERISTICS
AC CHARACTERISTICS
FUNCTIONAL CHARACTERISTICS
Baseband transmit (BSI to TXI/Q)
Baseband receive (RXI/Q to BSI)
Voice band transmit (microphone to ASI)
Voice band receive (ASI to earphone)
Auxiliary digital-to-analog converters
Auxiliary analog-to-digital converters:
AUXADC1, AUXADC2, AUXADC3 and
AUXADC4
Typical total current consumption
Typical output loads
APPLICATION INFORMATION
Wake-up procedure from Sleep mode
Microphone input connection and test set-up
PACKAGE OUTLINES
SOLDERING
Introduction to soldering surface mount
packages
Reflow soldering
Wave soldering
Manual soldering
Suitability of surface mount IC packages for
wave and reflow soldering methods
DEFINITIONS
LIFE SUPPORT APPLICATIONS
1999 May 03
2
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