ST7636R
3. ST7636R Pad Arrangement (COG)
Chip Size :
with seal ring & scribe line : 15,090 um x 1,410um
Bump Pitch:
PAD NO 1 ~ 484, 605~648: 31 um (COM/SEG)
PAD NO 485 ~ 604: 110 um (O)
Bump size:
PAD NO.1~440, 479~484, 605~610 :
16 um(x) X 118 um(y)
PAD No.441~ 478, 611~648:
118 um(x) X 16 um(y)
PAD N0. 485~604, Dummy Pad:
90 um(x) X 40 um(y)
Bump Height: 15 um
Chip Thickness: 400 um
Ver 1.4
2/109
2006/09/06