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B13NK60Z 查看數據表(PDF) - STMicroelectronics

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产品描述 (功能)
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B13NK60Z Datasheet PDF : 18 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
STB13NK60ZT4, STx13NK60Z, STP13NK60ZFP
1
Electrical ratings
Electrical ratings
Table 2. Absolute maximum ratings
Symbol
Parameter
VDS Drain-source voltage (VGS = 0)
VGS Gate-source voltage
ID
Drain current (continuous) at TC = 25 °C
ID
Drain current (continuous) at TC = 100 °C
IDM (2) Drain current (pulsed)
PTOT Total dissipation at TC = 25 °C
Derating factor
Vesd(G-S) G-S ESD (HBM C=100pF, R=1.5 kΩ)
dv/dt (3) Peak diode recovery voltage slope
VISO Insulation withstand voltage (AC)
Tj
Operating junction temperature
Tstg Storage temperature
1. Limited only by maximum temperature allowed
2. Pulse width limited by safe operating area
3. ISD 13 A, di/dt 200 A/µs, VDD V(BR)DSS, TJ TJMAX
Value
TO-220 / TO-247
Unit
TO-220FP
D²PAK
600
V
± 30
V
13
13 (1)
A
8.2
8.2 (1)
A
52
52(1)
A
150
35
1.20
0.27
4000
4.5
W
W/°C
V
V/ns
--
2500
V
-55 to 150
°C
Table 3. Thermal data
Symbol
Parameter
Rthj-case Thermal resistance junction-case max
Rthj-pcb (1) Thermal resistance junction-pcb max
Rthj-amb Thermal resistance junction-amb max
Tl
Maximum lead temperature for soldering
purpose
1. When mounted on minimum footprint
TO-220
TO-247
Value
Unit
D²PAK TO-220FP
0.83
3.6
°C/W
--
60
--
°C/W
62.5
°C/W
300
°C
Doc ID 8527 Rev 7
3/18

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