TD62784AFWG 查看數據表（PDF） - Toshiba
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TD62784AFWG Datasheet PDF : 11 Pages
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ABSOLUTE MAXIMUM RATINGS (Ta = 25°C)
TD62783,784APG/AFWG
CHARACTERISTIC
SYMBOL
RATING
UNIT
Supply Voltage
Output Current
Input Voltage
Clamp Diode Reverse Voltage
Clamp Diode Forward Current
Power Dissipation
APG
AFWG
Operating Temperature
Storage Temperature
VCC
IOUT
VIN (Note 1)
VIN (Note 2)
VR
IF
PD
Topr
Tstg
50
V
−500
mA / ch
15
V
30
50
V
500
mA
1.47
W
0.92 / 1.31 (Note 3)
−40~85
°C
−55~150
°C
Note 1: Only TD62783APG / AFWG
Note 2: Only TD62784APG / AFWG
Note 3: On Glass Epoxy PCB (75 × 114 × 1.6 mm Cu 20%)
RECOMMENDED OPERATING CONDITIONS (Ta = −40~85°C)
CHARACTERISTIC
SYMBOL
TEST CONDITION
MIN TYP. MAX UNIT
Supply Voltage
Output Current
TD62783,784APG
TD62783,784AFWG
Input Voltage
TD62783APG / AFWG
TD62784APG / AFWG
Input
Voltage
Output
On
Output
Off
TD62783APG / AFWG
TD62784APG / AFWG
TD62783APG / AFWG
TD62784APG / AFWG
Clamp Diode Reverse Voltage
Clamp Diode Forward Current
Power Dissipation
APG
AFWG
VCC
IOUT
VIN
VIN (ON)
VIN (OFF)
VR
IF
PD
⎯
⎯
Duty = 10% 8Circuits ⎯
Ta = 85°C Duty = 50% 8Circuits ⎯
Tj = 120°C
Tpw = 25ms Duty = 10% 8Circuits ⎯
Duty = 50% 8Circuits ⎯
⎯
⎯
⎯
⎯
⎯
2.0
⎯
4.5
⎯
0
⎯
0
⎯
⎯
⎯
⎯
Ta = 85°C
⎯
Ta = 85°C
(Note) ⎯
⎯
50
V
⎯ −260
⎯
−59 mA /
⎯ −180 ch
⎯ −38
⎯
12
V
⎯
24
5.0
15
12.0 30
V
⎯
0.8
⎯
2.0
⎯
50
V
⎯ 400 mA
⎯ 0.76
W
⎯ 0.68
Note: On Glass Epoxy PCB (75 × 114 × 1.6 mm Cu 20%)
2
2006-09-21
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