TDM300 查看數據表（PDF） - Microsemi Corporation
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TDM300 Datasheet PDF : 2 Pages
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Twin Diode Module
TDM300
A
D
Dim. Inches
Millimeters
E
Min. Max. Min.
Max. Notes
F
G
H
L
K
J
B
Baseplate
A=Common Anode
A ---
B 1.240
C ---
4.600
1.260
.925
---
31.49
---
116.84
32.00
23.49
D 3.99 BSC
101.34 BSC
E 1.98 BSC
50.29 BSC
F 0.320
0.340 8.13
8.64
Dia.
Baseplate
Common Cathode
G ---
H 0.630
J 0.680
---
---
0.780
---
16.00
17.27
--- 5/16-18
---
19.81
H
K 0.610
0.640 15.49
16.26
L ---
.100 ---
2.54
C
Baseplate
M 0.182
0.192 4.62
4.88
D=Doubler
M
Notes:
Baseplate: Nickel plated
copper.
Microsemi
Working Peak
Repetitive Peak
Catalog Number
Reverse Voltage Reverse Voltage
TDM30002*
200V
200V
TDM30004*
400V
400V
TDM30006*
600V
600V
TDM30008*
800V
800V
TDM30010*
1000V
1000V
TDM30012*
1200V
1200V
TDM30014*
1400V
1400V
TDM30016*
1600V
1600V
*Add Suffix A for Common Anode, D for Doubler
Compact Package
Glass Passivated Die
2 x 300 Amp Current Rating
Simplifies Circuit Assembly
Non-Isolated Baseplate
VRRM 200-1600 Volts
ROHS Compliant
Electrical Characteristics
Average forward current per pkg
Average forward current per leg
Maximum surge current per leg
Max I2 t for fusing
Max peak forward voltage per leg
Max peak reverse current per leg
Max peak reverse current per leg
I F(AV) 600 Amps
I F(AV) 300 Amps
I FSM 5500 Amps
I2 t 125990 A2 s
VFM 1.1 Volts
I RM 10 mA
I RM 75 uA
TC = 130°C, half sine, R0JC = 0.08°C/W
TC = 130°C, half sine, R0JC = 0.15°C/W
8.3 ms, half sine,T J = 175°C
I FM = 300A:T J = 25°C*
VRRM,TJ = 150°C
VRRM,TJ = 25°C*
*Pulse test: Pulse width 8.33 msec, Duty cycle <1%
Thermal and Mechanical Characteristics
Storage temp range
Operating junction temp range
Max thermal resistance per leg
Typical thermal resistance per leg (greased)
Terminal Torque
Mounting Base Torque (outside holes)
Mounting Base Torque (center hole)
center hole must be torqued first
Weight
T STG
TJ
R OJC
R OCS
-55°C to 175°C
-55°C to 175°C
0.15°C/W Junction to case
0.04°C/W Case to sink
60-75 inch pounds
30-40 inch pounds
8-10 inch pounds
9.3 ounces (263.7 grams) typical
www.microsemi.com
January, 2010 - Rev. 3
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