TEA5570 查看數據表（PDF） - Philips Electronics
零件编号
产品描述 (功能)
比赛名单
TEA5570 Datasheet PDF : 19 Pages
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Philips Semiconductors
RF/IF circuit for AM/FM radio
PACKAGE OUTLINE
DIP16: plastic dual in-line package; 16 leads (300 mil); long body
Product specification
TEA5570
SOT38-1
D
L
Z
e
b
16
pin 1 index
A2 A
A1
wM
b1
9
ME
c
(e 1)
MH
E
1
8
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
c
D (1)
E (1)
e
mm
4.7
0.51
3.7
1.40
1.14
0.53
0.38
0.32
0.23
21.8
21.4
6.48
6.20
2.54
inches
0.19
0.020
0.15
0.055 0.021 0.013
0.045 0.015 0.009
0.86
0.84
0.26
0.24
0.10
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
e1
7.62
0.30
L
3.9
3.4
0.15
0.13
ME
8.25
7.80
0.32
0.31
MH
w
Z (1)
max.
9.5
8.3
0.254
2.2
0.37
0.33
0.01 0.087
OUTLINE
VERSION
SOT38-1
IEC
050G09
REFERENCES
JEDEC
EIAJ
MO-001AE
EUROPEAN
PROJECTION
ISSUE DATE
92-10-02
95-01-19
September 1987
18
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